TECACOMP® LCP LDS black 1049426

TECACOMP® LCP LDS black 1049426 by Ensinger is a liquid crystal polymer (LCP) developed for the LPKF-LDS® process. Offers reduced thermal expansion in the event of temperature changes and enhanced thermal conductivity for improved cooling. Suitable for all popularly used soldering techniques up to 260°C and optimized filler systems for fine pitch structures up to 70µm. LDS requires the compound to have high thermal resistance, isotropic component behavior and good capacity for metallization. Suggested for processing by injection molding. Designed for automotive industry, electrical engineering, LED lighting technology and mechanical engineering. TECACOMP® LCP LDS black 1049426 is used in compounds for laser direct structuring, smart phone antennae, hearing aid and 3D HIPMAS.