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by SpecialChem

SKYBOND® 8500

Technical Datasheet | Supplied by Industrial Summit Technology

SKYBOND® 8500 by Industrial Summit Technology is a polyimide (PI) grade by Industrial Summit Technology. Exhibits excellent thermal stability. SKYBOND® 8500 is suitable for processing by resin transfer molding (RTM). Used in aerospace and aircrafts.

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Product Type

PI (Polyimide) > PI

Product Status

COMMERCIAL

Applications/ Recommended for

Aerospace/ Aircrafts
Conversion of composites & thermosets > Resin transfer molding

Access full datasheet

SKYBOND® 8500 Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Solid Content

98 %

(minimum)

Melt Viscosity

< 1000 cP

(250°C, 1 hr)

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