KLENZ purging compound No. 468

KLENZ purging compound No. 468 by Slide Products is a revolutionary purging compound requiring no mixing or preparation time. With operating temperatures of 330°F-610°C. It is a chemically reactive compound formulated with a polyolefin resin carrier that is excellent for use through hot runner systems. Also safe to purge through the mold and helps eliminate color streaking & black specs. Available as odorless, white to light grey granules. Suitable for use with injection molding, extrusion and blow molding. KLENZ purging compound No. 468 by Slide Products is GRAS rated so it is safe to use for food packaging applications.