TAGS: Electrical & Electronics High Heat Materials
Kaneka Corporation has developed Pixeo™ IB, a super heat-resistant polyimide film for high-speed, high frequency 5G. Pixeo™ IB reduces the dielectric loss tangent in high frequencies down to 0.0025, the global best level for polyimide film. This was achieved using the advanced polyimide development technologies that Kaneka has accumulated over many years. This makes possible the handling of 5G millimeter wave zones, which can realize high speed communications.
Wave-supporting Products for 5G Models
With the emergence of 5G-equipped smartphones, which are said to reach communication speeds of around 100 times of 4G, 5G models in the global smartphone market are predicted to spread rapidly from here on. With both the millimeter wave-supporting Pixeo
™ IB and the Pixeo
™ SR that handles sub-6, Kaneka will expand their lineup of 5G-supporting products and grow sales of these materials that help digital devices reach more advanced functionalities.
In terms of materials for supporting high-speed information transmission, Kaneka owns a high share of the market with the super heat-resistant polyimide Pixeo
™. However, Kaneka continues to provide a variety of solutions through different kinds of polyimide products. These include transparent polyimide film for flexible displays that acts as a glass substitute, polyimide varnish for a TFT substrate, and ultra-high thermal conductive graphite sheets.
Source: Kaneka Corporation