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Dow Corning to Show Silicone Encapsulant for Power Electronic Devices at PCIM Europe 2016

Published on 2016-05-05. Author : SpecialChem

Dow Corning Corporation, among the global leaders in silicones, silicon-based technology and innovation, announced that two of its electronics technical experts will speak at PCIM Europe 2016, scheduled to run in Nuremburg, Germany from May 10 to 12. The company, co-exhibiting with its German distributor Biesterfeld Spezialchemie, will also spotlight at Booth #519 in Hall 7 its broad and growing portfolio of advanced silicones for thermal management, protection and assembly of electronic modules, as well as its silicon carbide (SiC) wafer products for power device fabrication.

Dow Corning Corporation
Fig. 1: Dow Corning Corporation

"As a leading global supplier of both silicone and silicon carbide technology, Dow Corning is uniquely positioned to help module makers create more efficient, reliable and cost-effective power electronic devices," said Craig Bromley, European marketing manager, Electronics at Dow Corning. "Combined with our 70-year history of collaborative innovation with industry leaders, we are committed to helping customers along the entire electronics value chain to enhance the productivity, performance and reliability of power electronic products targeting advanced applications in transportation, industry and energy."

Eric Vanlathem and Thomas Seldrum – Dow Corning application engineers – will present posters highlighting high-performance silicone solutions aimed at driving advances in power electronics. Titles and details of each poster include:
  • "New Silicone Gel Enabling High Temperature Stability for Next Generation Power Modules," will detail and validate the performance of a silicone gel encapsulant that retains its flexibility, dielectric strength and adhesion to substrates after several thousands of hours of aging at 225° C.
  • "Low Stress Silicone Encapsulant Enables Distributed Power Generation," describes how Dow Corning® EE-3200 Low-Stress Silicone Encapsulant helps to minimize stress on power electronic components during thermal cycling, thereby helping to enhance the reliability, durability and lifetime of advanced conversion devices for distributed power generation.

The Dow Corning/Biesterfeld booth will showcase a very broad portfolio of silicone and SiC solutions for optimizing the performance, efficiency and reliability of power electronic modules. In addition to the low-stress Dow Corning EE-3200 gel featured during the poster session, Dow Corning will highlight other ground-breaking product technologies, including:
  • The new and recently launched Thermal Radical Cure technology, Dow Corning® EA-7100 Adhesive, which cures rapidly and at lower temperatures from the "inside out" to greatly accelerate processing, lower energy use and reduce material costs. This advanced adhesive can form strong bonds to a broad range of materials including traditionally challenging substrates such as polyethylene, polycarbonate and acetal without requiring pre-treatment or extensive cleaning. Initially targeting automotive applications, Dow Corning EA-7100 Adhesive’s unique benefits are attracting increasing interest from power electronics fabricators.
  • High-heat resistant solutions, such as Dow Corning® EG-3896 and Dow Corning® EG-3810 Silicone Gels target power modules rated at 175° C. These advanced encapsulant materials withstand higher junction temperatures, allowing for higher power densities that, in turn, enable development of smaller modules.
  • Thermal management solutions, such as Dow Corning® TC-4525 Gap Filler delivers thermal conductivity of 2.5 W/mK, greatly improved dispensability, significantly reduced abrasiveness and stable performance for more reliable electronics in harsh automotive underhood environments.

A further highlight at the booth will be Dow Corning’s portfolio of high-quality 4H n+ SiC solutions for power electronics applications. The company offers three tiers of manufacturing quality SiC substrates available as 100- or 150-mm-diameter wafers (bare) and with SiC epitaxial layers (n- or p-type). Labeled Prime Standard, Prime Select and Prime Ultra, each wafer tier offers progressively more stringent tolerances on critical defect types that adversely impact device performance.

A trusted innovation partner, Dow Corning® brand materials and collaborative expertise span the entire power electronics value chain, from wafer fabrication to device packaging solutions to complete module and system assembly. For decades, leading power electronics companies around the world have turned to Dow Corning for high performance materials and technologies, advanced application expertise, reliable supply and customer service around the globe.

Biesterfeld’s electronic team supports with product selection tailored to the individual needs of each customer. This includes technological expertise and customized solutions as well as comprehensive market knowledge.

About Dow Corning
Dow Corning provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide.

Among the global leaders in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company's Dow Corning® and XIAMETER® brands. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning's annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative, a stringent set of standards designed to advance the safe and secure management of chemical products and processes.

About Biesterfeld Spezialchemie


Biesterfeld Spezialchemie GmbH is among the leading, globally active distributors with a focus on specialty chemicals in the fields of:
  • LifeScience (healthcare, cosmetics, household cleaning products, organic synthesis)
  • Nutrition (culinary/spice, sweet/fruit, dairy, beverage, functional food)
  • CASE (coatings, adhesives, sealants, elastomers, epoxy, polyurethane, construction)
  • Performance Products (electronics, power, photovoltaics industries, composites, silicone elastomers and products for automotive).

As a competent and reliable distribution partner of leading global suppliers, the company operates in more than 20 locations throughout Europe and South America with over 250 employees. Biesterfeld Spezialchemie is part of the Biesterfeld Group, in business since 110 years as a trading and service company. The group is one of the leading companies in the distribution of chemicals and polymers with over 50 locations in Europe, North and South America, Asia as well as Africa. The largely family-owned group of companies aims at steady profitable future growth in its three business areas, namely Biesterfeld Plastic, Biesterfeld Spezialchemie and Biesterfeld International.

Source: Dow Corning

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