by SpecialChem

EPO-TEK® OD1001

Technical Datasheet | Supplied by Epoxy Technology

EPO-TEK® OD1001 by Epoxy Technology is a thermal and electrically insulating, single component epoxy resin. Exhibits low glass transition temperature, several weeks of pot life and low modulus. Suitable for bonding ferrite cores in power device packaging. EPO-TEK® OD1001 is designed for low stress semiconductor and electronic packaging. It has a pot life of 28 days. The shelf life of this grade is 1 year at -40°C.

EPO-TEK® OD1001 Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Cure Time

> 1 hr

(at 125°C)

Viscosity

1000 - 1500 cps

(at 23°C, 100 rpm)

Thixotropic index

1.2

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