INSUL-PLATE™ X-28057-2HT

INSUL-PLATE™ X-28057-2HT by Sumitomo Bakelite is a short glass fiber epoxy molding compound. Offers high dielectric breakdown, superb insulation, adhesion to copper & aluminium, excellent machinability and excellent chemical resistance while etching. Provides no shrinkage during curing & plating to maintain flush surfaces and shows controlled particle distribution for high density holes. It readily accepts plating, withstands temperature to 500°F and processes free void. INSUL-PLATE™ X-28057-2HT is suitable for processing by compression molding. Used as hole-fill powder in printed circuit boards. The minimum shelf life is 6 months at 4°C.