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ForTii® Eco LDS62

Technical Datasheet | Supplied by DSM
ForTii® Eco LDS62 by DSM is a bio-based, high temperature soldering resistant, high performance polyamide grade. Partially produced from renewable resources and castor beans as the basis for C10 chemistry. Provides halogen-free increased performance compared to alternative mineral oil-based solutions and shows low sensitivity to moisture. Exhibits high toughness, high flow, improved processing window and good mechanical- & dielectric strength. Enables reduction in costs while still being able to produce parts that meet OEM (original equipment manufacturer) requirements. Contains a special technology that enables incorporation of very fine and precise electrical circuitry by highly cost-effective laser direct structuring (LDS). Parts produced show very good dielectrics, good surface quality and high mechanical robustness. Highly suitable for antennas for mobile electronics, RFID security casings, and switches found in many portable electronic devices. ForTii® Eco LDS62 by DSM has a bio-content ranging from 10% to 25% by weight on a compound basis.
Product Type
PA (Polyamide, Nylon) > PA (Nylon), Bio-based
Product Launch Date
Apr 13, 2016
Product Status
COMMERCIAL
Geographical Availability
Central and Eastern Europe, Western Europe
Applications/ Recommended for
Telecom > Antennas
Biodegradable
No
Bio Based
No
Bio Based Content (%)
10-25%, Castor-bean derived
Filled with Bio Fillers
No
Key Features
  • Flow, High
  • Halogen Free
  • Heat Resistance, High
  • Moisture Absorption, Low
  • Processability, Good
  • Toughness, Good

ForTii® Eco LDS62 Properties

Physical Properties

Value & Unit
Test Condition
Test Method
Linear Mold Shrinkage, Flow
0.3 %
( )
ISO 294-4
Linear Mold Shrinkage
1.2 %
( )
ISO 294-4
Density
1500 kg/m3
( )
ISO 1183

ForTii® Eco LDS62 Processing Guidelines

Injection molding Properties

Value & Unit
Test Condition
Test Method
Drying Time
2 hr
Nozzle Temperature
310 - 325 °C
Front Temperature
310 - 325 °C

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