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DAIAMID® A6492

Technical Datasheet | Supplied by Evonik

DAIAMID® A6492 by Evonik is a copolyamide (PA), metal bonding grade. It is developed by Daicel-Evonik's unique compounding technology with Evonik Industries AG's co-polyamides. Exhibits good weatherability, mechanical properties, low melting point and good adhesion properties. Offers moldability with low temperature, low pressure and short cycle, chemical-, oil- and solvent resistance. DAIAMID® A6492 is suitable for processing by injection sealing.

DAIAMID® A6492 Processing Guidelines

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Suggested Max. Moisture

< 0.12 %

Drying Time

4 hr

Drying Temperature

70 °C

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