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VESTAMID® HTplus LDS1031

Technical Datasheet | Supplied by Evonik

VESTAMID® HTplus LDS1031 by Evonik is a stabilized polyphthalamide (PA6T/X) grade reinforced with 10% glass fiber and mineral. Exhibits good dimensional stability, glossy surface, medium viscosity. It is qualified for LPKF-laser direct structuring (LDS) process & optimized shrinkage and suitable for lead-free solders. It is suitable for processing by injection molding. VESTAMID® HTplus LDS1031 is recommended for three-dimensional interconnect devices in electronical applications, specially adapted for the laser direct structuring (LDS) process applications.

VESTAMID® HTplus LDS1031 Properties

Thermal Properties

Value & Unit

Test Condition

Test Method

Melting Point

300 - 315 °C

(2nd heating, DSC)

ISO 11357

Heat Deflection Temperature (HDT)

272 °C

(Method A, 1.8 MPa)

ISO 75

Heat Deflection Temperature (HDT)

286 °C

(Method B, 0.45 MPa)

ISO 75

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