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SEPAZ™ HT61X10

Technical Datasheet | Supplied by Mando Advanced Materials

SEPAZ HT61X10 by Mando Advanced Materials is a modified polyphenylene oxide (MPPO) grade, exhibiting excellent heat resistance. Designed for injection molding method. SEPAZ HT61X10 is recommended for manufacturing of chip tray. Complies with UL 94 HB Flame Rating.

SEPAZ™ HT61X10 Properties

Mechanical Properties

Value & Unit

Test Condition

Test Method

Tensile Strength

750 kgf/cm²

(at Break, 50mm/min)

ASTM D638

Tensile Elongation

30 %

(at Break, 50mm/min)

ASTM D638

Flexural Strength

1.000 kgf/cm²

(3mm/min)

ASTM D790

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Drying Temperature

80 - 120 °C

Drying Time

2 - 4 hr

Cylinder temperature (Rear)

270 - 300 °C

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SEPAZ™ HT61X10

SEPAZ™ HT61X10 Properties

Mechanical Properties

SEPAZ™ HT61X10 Processing Guidelines

Injection Molding Properties