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Bergamid™ B70 GK30 WT027

Technical Datasheet | Supplied by Avient (Formerly PolyOne)

Bergamid™ B70 GK25 BK021 is a 30 wt. % glass bead reinforced PA (polyamide) 6 compound. It exhibits stiffness even at low temperatures. Also exhibits excellent thermal properties, very good cost/ performance ratio, excellent balance of stiffness/ toughness, high mechanical strength, good electrical properties and good chemical-, abrasion- & friction resistance. Has been designed to stand up to the most demanding applications and operating environments. Can be processed using injection molding. Applications include transportation, household appliance, electrical, and electronic industries.

Bergamid™ B70 GK30 WT027 Properties

Thermal Properties

Value & Unit

Test Condition

Test Method

Heat Deflection Temperature (HDT), Unannealed

70 °C

(At 264 psi (1.80 MPa), 3.2 mm)

ASTM D648

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Drying Temperature

80 - 90 °C

Drying Time

2 - 4 hr

Mold Temperature

65 - 85 °C

*The last time this product was checked, its availability could not be confirmed. If you have more information about its availability, please contact us.

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Bergamid™ B70 GK30 WT027

Bergamid™ B70 GK30 WT027 Properties

Thermal Properties

Bergamid™ B70 GK30 WT027 Processing Guidelines

Injection Molding Properties