by SpecialChem

LNP™ THERMOCOMP™ Compound 9X99089

LNP™ THERMOCOMP™ Compound 9X99089 by SABIC is a compound based on PFAS-free, polyetherimide (PEI) resin that is filled with 20% carbon fiber. It exhibits electrical conductivity and high stiffness, strength and temperature resistance. This grade is processed by injection molding. It is recommended for building components and constructions, consumer applications like sport/leisures, personal accessory and home & commercial appliances. LNP™ THERMOCOMP™ Compound 9X99089 is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

LNP™ THERMOCOMP™ Compound 9X99089 Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Linear Mold Shrinkage, Flow

0.4 %

SABIC Method

Density

1.34 g/cm³

(At 23°C 80×10×4)

ISO 1183

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Melt Temperature

360 - 365 °C

Moisture Content

< 0.02 %

Drying Temperature

120 - 150 °C

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LNP™ THERMOCOMP™ Compound 9X99089

LNP™ THERMOCOMP™ Compound 9X99089 Properties

Physical Properties

LNP™ THERMOCOMP™ Compound 9X99089 Processing Guidelines

Injection Molding Properties