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LNP™ THERMOCOMP™ Compound DF008

LNP™ THERMOCOMP™ Compound DF008 by SABIC is a compound based on PFAS-free, polycarbonate (PC) resin that is filled with 40% glass fiber. It offers high stiffness & strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound DF008 is recommended for building components & constructions and consumer applications like personal accessory. It is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

LNP™ THERMOCOMP™ Compound DF008 Properties

Thermal Properties

Value & Unit

Test Condition

Test Method

UL RTI, Electrical

125 °C

UL 746B

UL RTI, Mechanical with Impact

115 °C

UL 746B

UL RTI, Mechanical without Impact

125 °C

UL 746B

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Melt Temperature

305 - 325 °C

Moisture Content

< 0.02 %

Mold Temperature

80 - 110 °C

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LNP™ THERMOCOMP™ Compound DF008

LNP™ THERMOCOMP™ Compound DF008 Properties

Thermal Properties

LNP™ THERMOCOMP™ Compound DF008 Processing Guidelines

Injection Molding Properties