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LNP™ THERMOCOMP™ Compound DX09309

Technical Datasheet | Supplied by SABIC
LNP™ THERMOCOMP™ Compound DX09309 by SABIC is a compound based on PFAS-free, unreinforced polycarbonate resin. It shows high dielectric constant. It is processed by injection molding. It is used in automotive interiors and consumer applications like personal accessories. LNP™ THERMOCOMP™ Compound DX09309 is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.
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Product Type
PC (Polycarbonate) > PC
Product Launch Date
Aug 6, 2015
Product Status
COMMERCIAL

LNP™ THERMOCOMP™ Compound DX09309 Properties

Physcial Properties

Value & Unit
Test Condition
Test Method
Linear Mold Shrinkage, Flow
0.65 %
(At 3.2 mm) 
SABIC Method
Linear Mold Shrinkage, Transverse
0.56 %
(At 3.2 mm) 
SABIC Method
Melt Volume Flow Rate (MVR)
15.7 cm3/10 min
(At 280°C, 2.16kg) 
ASTM D1238

LNP™ THERMOCOMP™ Compound DX09309 Processing Guidelines

Injection Properties

Value & Unit
Test Condition
Test Method
Back Pressure
1 - 5 MPa
Front Zone 3 Temperature
280 - 320 °C
Drying Time
3 - 5 hr
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