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LNP™ THERMOCOMP™ Compound GF004 (Asia)

Technical Datasheet | Supplied by SABIC
LNP™ THERMOCOMP™ Compound GF004 (Asia) by SABIC is a PFAS-free, high heat resistant, polysulfone (PSU) resin reinforced with 20% glass fiber. It offers high strength and stiffness. LNP™ THERMOCOMP™ Compound GF004 (Asia) can be processed by injection molding. It is recommended for building components and constructions, consumer applications like sports, leisures, personal accessorys and home- & commercial appliances. It is suitable for electrical and electronic applications such as mobile phones, computers & tablets. It is designed for use in electrical & defense industries.
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LNP™ THERMOCOMP™ Compound GF004 (Asia)
Technical Datasheet | Supplied by SABIC
REQUEST A SAMPLE ORIGINAL DATASHEET CONTACT SUPPLIER
Product Type
PSU (Polysulfone) > PSU
Product Status
COMMERCIAL
Geographical Availability
Asia / Pacific

LNP™ THERMOCOMP™ Compound GF004 (Asia) Properties

Thermal Properties

Value & Unit
Test Condition
Test Method
Deflection Temperature at 0.46 MPa (66 psi)
180 °C
(At Flatw 80x10x4 sp=64mm) 
ISO 75-Bf
Deflection Temperature at 1.8 MPa (264 psi)
174 °C
(At Flatw 80x10x4 sp=64mm) 
ISO 75-Af
CTE, Linear, Parallel to Flow
2.50E-05 1/°C
(At -40°C to 40°C) 
ISO 11359-2
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