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LNP™ THERMOCOMP™ Compound LC004XXP

Technical Datasheet | Supplied by SABIC
LNP™ THERMOCOMP™ Compound LC004XXP by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin filled with 20% carbon fiber. This electrically conductive grade offers high stiffness, strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC004XXP is recommended for electrical industry and electronic components such as mobile phones, computers and tablets. It is suitable for material handling.
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LNP™ THERMOCOMP™ Compound LC004XXP
Technical Datasheet | Supplied by SABIC
REQUEST A SAMPLE ORIGINAL DATASHEET CONTACT SUPPLIER
Product Type
PK (Polyketone) > PEEK
Product Status
COMMERCIAL
Geographical Availability
Africa, Asia / Pacific, Central and Eastern Europe, Middle East and Central Asia, North America, South and Central America, Western Europe
Applications/ Recommended for
  • Electronics / Computers > Electronic components (capacitors...)
  • Electrical markets
  • Injection molding - thermoplastics
Key Features
  • Electrically Conductive
  • Filled, Carbon fiber
  • Heat Resistance, High
  • Stiffness, High
  • Strength, High

LNP™ THERMOCOMP™ Compound LC004XXP Properties

Physical Properties

Value & Unit
Test Condition
Test Method
Linear Mold Shrinkage, Flow
0.1 - 0.3 %
SABIC Method
Density
1.36 g/cm3
ISO 1183

LNP™ THERMOCOMP™ Compound LC004XXP Processing Guidelines

Injection Properties

Value & Unit
Test Condition
Test Method
Drying Time
4 hr
Rear Zone 1 Temperature
350 - 360 °C
Screw Speed
60 - 100 rpm
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