by SpecialChem

LNP™ THERMOCOMP™ Compound LC006 (Americas)

LNP™ THERMOCOMP™ Compound LC006 (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% carbon fiber. This electrically conductive grade exhibits high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC006 (Americas) is recommended for electrical and electronic components such as mobile phones, computers and tablets. It is suitable for industrial material handling.

LNP™ THERMOCOMP™ Compound LC006 (Americas) Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Linear Mold Shrinkage, Flow

0.12 %

(At 24 hr)

ISO 294

Linear Mold Shrinkage, Transverse

0.4 %

(At 24 hr)

ISO 294

Moisture Absorption

0.07 %

(At 23°C, 50% R.H.)

ISO 62

Injection Properties

Value & Unit

Test Condition

Test Method

Front Zone 3 Temperature

380 - 400 °C

Back Pressure

0.3 - 0.7 MPa

Drying Time

4 - 6 hr

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LNP™ THERMOCOMP™ Compound LC006 (Americas)

LNP™ THERMOCOMP™ Compound LC006 (Americas) Properties

Physical Properties

LNP™ THERMOCOMP™ Compound LC006 (Americas) Processing Guidelines

Injection Properties