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ESCONTEK® SP-PESC-566

Technical Datasheet | Supplied by Shakun Polymers
ESCONTEK® SP-PESC-566 is a semi-conducting compound having excellent heat deformation resistant characteristics. It has superior thermal stress crack resistance, toughness. It is also easy to process and has low volume resistivity. It has been formulated to be easily extrudable using polyethylene extrusion lines. Recommended for skin coating over PE sheath for XLPE insulated high and extra high voltage power cables. It meets with IEC - 60502 regulation.
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Product Type
Unspecified Thermoplastic > Unspecified Thermoplastic
Physical Form
Pellets, Free-flowing
Product Status
COMMERCIAL

ESCONTEK® SP-PESC-566 Properties

Physical Properties

Value & Unit
Test Condition
Test Method
Density
1.02 g/cm³
(27°C) 
ASTM D 1505
Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index)
28 g/10 min
(190°C, 21.6 Kg) 
ASTM D1238
Environmental Stress Cracking Resistance (ESCR)
< 500 hr
(10% Igepal) 
ASTM D 1693

ESCONTEK® SP-PESC-566 Processing Guidelines

Extrusion Properties

Value & Unit
Test Condition
Test Method
Melt Temperature
180 - 230 °C
Drying Temperature
70 - 75 °C
Drying Time
2 - 4 hr
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