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HiFill® PA6 GF/M55 HS L BK

Technical Datasheet | Supplied by Techmer PM

HiFill® PA6 GF/M55 HS L BK is a heat stabilized, lubricated polyamide 6 (PA6) resin reinforced with 15% glass fiber and 40% mineral fiber. Exhibits good chemical resistance and excellent toughness. It can be processed by injection molding. Used in 3D-printing market and large-part additive manufacturing.

HiFill® PA6 GF/M55 HS L BK Properties

Electrical Properties

Value & Unit

Test Condition

Test Method

Volume Resistivity

1.0E+13 ohm

ASTM D257

Dielectric Strength

400 V/mil

(Method A (Short-Time))

ASTM D149

Injection Properties

Value & Unit

Test Condition

Test Method

Front Temperature

500 - 580 °F

Back Pressure

0 - 50 psi

Rear Temperature

500 - 580 °F

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HiFill® PA6 GF/M55 HS L BK

HiFill® PA6 GF/M55 HS L BK Properties

Electrical Properties

HiFill® PA6 GF/M55 HS L BK Processing Guidelines

Injection Properties