EPON™

EPON™ 1001-A-80 by Hexion is a solid epoxy resin solution. It contains 80% solids in acetone. EPON™ 1001-A-80 is suitable for adhesives (structural & multi-purpose), civil engineering (thin films &... view more

EPON™ 1001-DNT-75 by Hexion is a solid epoxy resin solution. It contains 75% solids in diacetone alcohol/ n-butanol/ toluene. EPON™ 1001-DNT-75 is suitable for adhesives (structural &... view more

EPON™ 1001-FT-75 by Hexion is a solid epoxy resin solution. It contains 75% solids in n-butanol/ toluene. EPON™ 1001-FT-75 is suitable for adhesives (structural & multi-purpose), civil engineering... view more

EPON™ 1001-G-70 by Hexion is a solid epoxy resin solution. It contains 75% solids in n-butyl acetate. EPON™ 1001-G-70 is suitable for adhesives (structural & multi-purpose), civil engineering (thin... view more

EPON™ 1001F by Hexion is a lowest molecular weight solid epoxy resin. Offers improved toughness, good flexibility, good flow control and tack. It is a standard resin for coatings and pre-preg and is... view more

EPON™ 1002F by Hexion is a high molecular weight solid epoxy resin. Offers better sintering resistance. EPON™ 1002F is suitable for adhesives (structural & multi-purpose), civil engineering (thin... view more

EPON™ 1004-O-65 by Hexion is a solid epoxy resin solution. It contains 65% solids in methyl n-amyl ketone (MNAK). EPON™ 1004-O-65 is suitable for adhesives (structural & multi-purpose), civil... view more

EPON™ 1004F by Hexion is a medium molecular weight solid epoxy resin containing hydroxyl groups. Offers improved toughness, good flexibility and good flow rheology control. It is reacted with... view more

EPON™ 1007-CT-55 by Hexion is a solid epoxy resin solution. It contains 55% solids in methyl isobutyl ketone (MIBK)/toluene. EPON™ 1007-CT-55 is suitable for adhesives (structural & multi-purpose)... view more

EPON™ 1007-FMU-50 by Hexion is a solid epoxy resin solution. It contains 50% solids in n-butanol/ ethylene glycol monobutyl ether/ aromatic 100. EPON™ 1007-FMU-50 is suitable for adhesives... view more

EPON™ 1007-HT-55 by Hexion is a solid epoxy resin solution. It contains 55% solids in propylene glycol monomethyl ether/ toluene. EPON™ 1007-HT-55 is suitable for adhesives (structural &... view more

EPON™ 1007F by Hexion is a moderately high molecular weight solid epoxy resin. It is used for industrial coatings cured with urea-formaldehyde and phenolformaldehyde resins. EPON™ 1007F is suitable... view more

EPON™ 1009-DU-40 by Hexion is a solid epoxy resin solution. It contains 40% solids in diacetone alcohol/ aromatic 100. EPON™ 1009-DU-40 is suitable for adhesives (structural & multi-purpose), civil... view more

EPON™ 1009-MX-40 by Hexion is a solid epoxy resin solution. It contains 40% solids in ethylene glycol monobutyl ether/ xylene. EPON™ 1009-MX-40 is suitable for adhesives (structural &... view more

EPON™ 1009F by Hexion is a high molecular weight solid epoxy resin. It is used for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. EPON™ 1009F is suitable for... view more

EPON™ 1031 by Hexion is an epoxy novolac resin. Contains tetraglycidyl ether of tetraphenol ethane. Offers high temperature and high chemical resistance. EPON™ 1031 is suitable for adhesives... view more

EPON™ 1031-A-70 by Hexion is an epoxy novolac resin solution. Contains 70 % solids in acetone. EPON™ 1031-A-70 is suitable for adhesives (structural & multi-purpose), civil engineering (thin films &... view more

EPON™ 1124-A-80 by Hexion is an acetone solution of brominated epoxy resin. Offers good flame resistance. It is used for electrical laminate applications. EPON™ 1124-A-80 is suitable for adhesives... view more

EPON™ 1163 by Hexion is a low melting solid brominated epoxy resin. Offers good flame resistance. It is used in electrical laminating, casting and molding applications. EPON™ 1163 is suitable for... view more

EPON™ 1510 by Hexion is a low viscosity, cycloaliphatic glycidyl ether epoxy resin. It is used to obtain epoxy performance in coatings, electronics and specialty composites where improved UV... view more

EPON™ 154 by Hexion is an epoxy novolac resin. Offers temperature resistance, good dimensional stability and high chemical resistance. EPON™ 154 is suitable for adhesives (structural &... view more

EPON™ 160 by Hexion is an epoxy bisphenol F novolac resin. Provides low viscosity, high functionality, easy processing, good thermal stability and good chemical resistance. EPON™ 160 is suitable for... view more

EPON™ 161 by Hexion is an epoxy bisphenol F novolac resin. Provides low viscosity, high functionality, easy processing, good thermal stability and good chemical resistance. EPON™ 161 is suitable for... view more

EPON™ 162 by Hexion is an epoxy bisphenol F novolac resin. Provides low viscosity, sdequate functionality, easy processing, good thermal stability and good chemical resistance. EPON™ 162 is suitable... view more

EPON™ 164 by Hexion is a solid epoxy cresol novolac resin. It is used in high performance laminates, molding compounds, aerospace composites, special adhesives and tooling systems. EPON™ 164 is... view more

EPON™ 165 by Hexion is a solid epoxy cresol novolac resin. It is used in high performance laminates, molding compounds, aerospace composites, special adhesives and tooling systems. EPON™ 165 is... view more

EPON™ 2002 by Hexion is a low to medium molecular weight solid epoxy resin. It is primarily used for thin film epoxy powder coating applications. EPON™ 2002 is suitable for adhesives (structural &... view more

EPON™ 2003 by Hexion is a medium molecular weight solid epoxy resin. It is primarily used for thin or thick epoxy powder coating applications. EPON™ 2003 is suitable for adhesives (structural &... view more

EPON™ 2004 by Hexion is a medium molecular weight solid epoxy resin. It is primarily used for thin or thick epoxy powder coating applications. EPON™ 2004 is suitable for adhesives (structural &... view more

EPON™ 2005 by Hexion is a moderately high molecular weight solid epoxy resin. It is primarily used for intermediate and thick film epoxy powder coating applications. EPON™ 2005 is suitable for... view more

EPON™ 2014 by Hexion is a moderately high molecular weight solid epoxy resin modified with epoxy phenol novolac. Offers good chemical resistance and good corrosion resistance. It is primarily used... view more

EPON™ 2024 by Hexion is a medium molecular weight solid epoxy resin. It contains a flow control agent. EPON™ 2024 is suitable for adhesives (structural & multi-purpose), civil engineering (thin... view more

EPON™ 2041 by Hexion is a modified, low to medium molecular weight solid epoxy resin. Offers improved flow. EPON™ 2041 is suitable for adhesives (structural & multi-purpose), civil engineering (thin... view more

EPON™ 235 by Hexion is a blend of BPA and BPF liquid epoxy resin. Offers improved crystallization resistance and low viscosity. EPON™ 235 is suitable for adhesives (structural & multi-purpose)... view more

EPON™ 3002 by Hexion is a modified solid epoxy resin. Offers low melt viscosity and high reactivity. It is primarily used for electrical encapsulation. EPON™ 3002 is suitable for adhesives... view more

EPON™ 53-BH-35 by Hexion is an ultra high molecular weight epoxy resin. It is used for adhesives and prepreg laminates to impart flexibility and to modify flow properties of the system. EPON™... view more

EPON™ 58005 by Hexion is a carboxyl-terminated butadiene acrylonitrile (CTBN) modified bisphenol A epoxy resin with an elastomer content of 40%. Offers good peel strength, good thermal shock... view more

EPON™ 58006 by Hexion is a carboxyl-terminated butadiene acrylonitrile (CTBN) modified bisphenol A epoxy resin with an elastomer content of 40%. Offers good flexibility and good fatigue resistance... view more

EPON™ 58034 by Hexion is a carboxyl-terminated butadiene acrylonitrile (CTBN) modified heloxy 68 epoxy resin with an elastomer content of 50%. Offers low viscosity and high toughness. It is used as... view more

EPON™ 58120 by Hexion is a carboxyl-terminated butadiene acrylonitrile (CTBN) modified solid epoxy resin with an elastomer content of 20%. Offers thermal shock, good fatigue resistance and good... view more

EPON™ 58901 by Hexion is a carboxyl-terminated butadiene acrylonitrile (CTBN) modified bisphenol A epoxy resin with an elastomer content of 5%. Offers good flexibility, tack for early green strength... view more

EPON™ 8021 by Hexion is a very low viscosity epoxy diacrylate resin. It imparts high reactivity and superior wetting characteristics. EPON™ 8021 is suitable for adhesives (structural &... view more

EPON™ 8111 by Hexion is a low viscosity epoxy triacrylate resin. Provides rapid reaction rates. It is used for high-build sealers, wear-resistant surfacing and low temperature cure applications... view more

EPON™ 8112 by Hexion is a liquid epoxy resin with heloxy 61-butyl glycidyl ether. Offers superior wetting characteristics and high viscosity. EPON™ 8112 is suitable for adhesives (structural &... view more

EPON™ 813 by Hexion is a liquid epoxy resin with heloxy 62-cresyl glycidyl ether. Offers good crystallization resistance and good chemical resistance. EPON™ 813 is suitable for adhesives (structural... view more

EPON™ 8131 by Hexion is a liquid epoxy resin with heloxy 505-castor oil glycidyl ether. Offers good flexibility. It is used for flooring and adhesive applications. EPON™ 8131 is suitable for civil... view more

EPON™ 8132 by Hexion is a liquid epoxy resin with heloxy 8-alkyl glycidyl ether. It is suitable for adhesives (structural & multi-purpose), civil engineering (thin films & high-build), coatings... view more

EPON™ 815C by Hexion is a liquid epoxy resin with heloxy 61-butyl glycidyl ether. Offers superior wetting characteristics. EPON™ 815C is suitable for adhesives (structural & multi-purpose), civil... view more

EPON™ 8161 by Hexion is a moderate viscosity epoxy diacrylate resin. It is used for flooring, grouts, adhesives, casting and encapsulation systems. EPON™ 8161 is suitable for adhesives (structural &... view more

EPON™ 8201 by Hexion is an anti-settling, anti-foaming liquid epoxy resin with heloxy 62-cresyl glycidyl ether. It is primarily used in highly filled systems. EPON™ 8201 is suitable for adhesives... view more

EPON™ 824 by Hexion is a modified liquid epoxy resin. Offers improved crystal resistance and low viscosity. EPON™ 824 is suitable for adhesives (structural & multi-purpose), civil engineering (thin... view more

EPON™ 825 by Hexion is an unmodified liquid epoxy resin. Offers ultra high purity and low viscosity. It is used for high solid coatings and specialty composites. EPON™ 825 is suitable for adhesives... view more

EPON™ 826 by Hexion is an unmodified liquid epoxy resin. Offers low viscosity. It is used in coatings and composite applications. EPON™ 826 is suitable for adhesives (structural & multi-purpose)... view more

EPON™ 827 by Hexion is an unmodified liquid epoxy resin. Offers medium viscosity. It is mainly used in composite applications. EPON™ 827 is suitable for adhesives (structural & multi-purpose), civil... view more

EPON™ 828 by Hexion is an unmodified, predominant liquid epoxy resin. It is widely used in multiple applications. EPON™ 828 is suitable for adhesives (structural & multi-purpose), civil engineering... view more

EPON™ 828-X-95 by Hexion is a liquid epoxy resin solution. It contains 95% solids in xylene. EPON™ 828-X-95 is suitable for adhesives (structural & multi-purpose), civil engineering (thin films &... view more

EPON™ 8280 by Hexion is an anti-foaming, anti-settling modified liquid epoxy resin. It is used for systems with fillers and pigments. EPON™ 8280 is suitable for adhesives (structural &... view more

EPON™ 8281 by Hexion is an anti-foaming, anti-settling modified liquid epoxy resin. It is used for silica filled systems. EPON™ 8281 is suitable for adhesives (structural & multi-purpose), civil... view more

EPON™ 829 by Hexion is a modified liquid epoxy resin. It is pre-catalyzed for subsequent up-staging with BPA. EPON™ 829 is suitable for adhesives (structural & multi-purpose), civil engineering... view more

EPON™ 830 by Hexion is an unmodified, high molecular weight liquid epoxy resin. It is suitable for adhesives (structural & multi-purpose), civil engineering (thin films & high-build), coatings... view more

EPON™ 834 by Hexion is an unmodified, highest molecular weight liquid epoxy resin. It is used in adhesives and as a modifier of liquid epoxy systems. EPON™ 834 is suitable for civil engineering... view more

EPON™ 834-X-80 by Hexion is a liquid epoxy resin solution. It contains 80% solids in xylene. EPON™ 834-X-80 is suitable for adhesives (structural & multi-purpose), civil engineering (thin films &... view more

EPON™ 836-C-75 by Hexion is a liquid epoxy resin solution. It contains 75% solids in methyl isobutyl ketone (MIBK). EPON™ 836-C-75 is suitable for adhesives (structural & multi-purpose), civil... view more

EPON™ 862 by Hexion is an unmodified, bisphenol F liquid epoxy resin. Offers low viscosity and good chemical resistance. It is used alone or in blends with other resins. EPON™ 862 is suitable for... view more

EPON™ 863 by Hexion is an unmodified liquid epoxy resin. Offers improved crystallization resistance. EPON™ 863 is suitable for adhesives (structural & multi-purpose), civil engineering (thin films &... view more

EPON™ 872 by Hexion is a modified liquid epoxy resin. Offers good flexibility, good toughness, good thermal shock and good impact resistance. EPON™ 872 is suitable for adhesives (structural &... view more

EPON™ 873-CX-80 by Hexion is a modified liquid epoxy resin solution. It contains 80% solids in methyl isobutyl ketone (MIBK)/xylene. Offers good flexibility, good toughness and reduced volatile... view more

EPON™ 874-B-90 by Hexion is a modified liquid epoxy resin solution. It contains 80% solids in methyl ethyl ketone (MEK). Offers good flexibility, good toughness and reduced volatile organic compound... view more

EPON™ 9215 by Hexion is an epoxy resin. Offers long term physical integrity, durability and resistance to chemical attack. It is used for CIPP (cured in place pipe) applications. EPON™ 9215 is... view more

EPON™ CS 241 by Hexion is a high viscosity, liquid epoxy resin with heloxy 8-alkyl glycidyl ether. It is suitable for adhesives (structural & multi-purpose), civil engineering (thin films &... view more

EPON™ CS 242 by Hexion is a medium viscosity, liquid epoxy resin with heloxy 8-alkyl glycidyl ether. It is most often used in flooring systems. EPON™ CS 242 is suitable for adhesives (structural &... view more

EPON™ CS 243 by Hexion is a liquid epoxy resin with heloxy 8-alkyl glycidyl ether. Provides easier handling with good overall performance. EPON™ CS 243 is suitable for adhesives (structural &... view more

EPON™ CS 258 by Hexion is a solid epoxy resin solution. It contains 50% solids in propylene glycol monomethyl ether acetate. EPON™ CS 258 is suitable for adhesives (structural & multi-purpose)... view more

EPON™ CS 377 by Hexion is a liquid epoxy resin solution. It contains 96% solids with heloxy 65-p-tert-butyl phenyl glycidyl ether. EPON™ CS 377 is suitable for adhesives (structural &... view more

EPON™ HPT 154-A-85 by Hexion is an epoxy novolac resin solution. Contains 85 % solids in acetone. EPON™ HPT 154-A-85 is suitable for adhesives (structural & multi-purpose), civil engineering (thin... view more

EPON™ Resin 1001-B-80 by Hexion is a 80% solids solution of an EPON 1001F type epoxy resin in methyl ethyl ketone. Exhibits low color, and chemical- & corrosion resistance. It can be used with... view more

EPON™ Resin 1001-CX-75 by Hexion is a 75% solids solution of an EPON Resin 1001F type epoxy resin in a blend of 65% methyl isobutyl ketone and 35% xylene. Exhibits low color, and chemical- &... view more

EPON™ Resin 1001-H-75 by Hexion is a 75% wt solid resin solution of EPON Resin 1001F epoxy resin derived from bisphenol-A and epichlorohydrin. It is diluted in propylene glycol methyl ether... view more

EPON™ Resin 1001-K-65 by Hexion is a VOC-free, non-HAPs, low viscosity, 65% solids solution of EPON Resin 1001F-type epoxy resin derived from bisphenol-A and epichlorohydrin. It is diluted in... view more

EPON™ Resin 1001-O-75 by Hexion is a non-HAP, 75% weight solid resin solution of EPON Resin 1001F epoxy resin in methyl n-amyl ketone (Mn-AK). It is derived from bisphenol-A and epichlorohydrin... view more

EPON™ Resin 1001-T-75 by Hexion is a 75% solids solution of an EPON Resin 1001F type epoxy resin diluted in toluene. Exhibits low color, and chemical- & corrosion resistance. It can be used with... view more

EPON™ Resin 1001-UY-70 by Hexion is a 70% solids solution of an EPON Resin 1001F type epoxy resin diluted in in aromatic solvent 100 and 2-propoxyethanol. Exhibits low color, and chemical- &... view more

EPON™ Resin 1001-X-75 by Hexion is a 75% solids solution of an EPON 1001F type epoxy resin diluted in xylene. Exhibits low color, and chemical- & corrosion resistance. It can be used with curing... view more

EPON™ Resin 834-F-90 by Hexion is a 90% weight solids solution of EPON Resin 834 epoxy resin in normal butyl alcohol (or n-butanol). It can be formulated to have excellent chemical-, impact- and... view more

EPON™ Resin 834-X-90 by Hexion is a 90% solids solution epoxy resin diluted in xylene. It can be formulated to have excellent chemical- and corrosion resistance. Exhibits easy handling, low... view more

EPON™ Resin 8521-MX-60 by Hexion is a 60% solids solution of an EPON Resin 1004F type epoxy resin diluted in 50% xylene and 50% 2-butoxyethanol. It does nor require additives for prevention of... view more

EPON™ Resin 872-X-75 by Hexion is a chemically modified, low viscosity, 75% by weight solution of bisphenol-A epoxy resin in xylene. Exhibits toughness, flexibility and reduced elevated temperature... view more

EPON™ Resin 874-CX-90 by Hexion is a VOC-compliant, 90% weight solids of bisphenol-A epoxy resin in xylene and methyl isobutyl ketone. Exhibits improved flexibility, reduced solution viscosity, long... view more

EPON™ Resin CS-267 by Hexion is a 65%wt solution of a modified fusion epoxy resin derived from solid bisphenol A/ epichlorohydrin. It is thinned in a 1:1 blend of propylene glycol methyl ether... view more

EPON™ Resin CS-373 by Hexion is a one-pack, dicy-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of methyl ethyl ketone (MEK) and propylene glycol... view more

EPON™ SU-2.5 by Hexion is an epoxy bisphenol A novolac resin. Provides good thermal stability and good chemical resistance. It is used in electrical, adhesive and composite applications. EPON™... view more

EPON™ SU-8 by Hexion is an epoxy bisphenol A novolac resin. Provides good green strength and good high temperature performance. It is used in electrical, adhesive and composite applications. EPON™... view more