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High Heat Engineered Molded Interconnect Device Resins

SpecialChem / Feb 13, 2008

While there are many industrial plastics available for use by the electronics industry, the range of plastics suitable for producing MIDs (molded interconnect devices) is limited. LPKF Laser & Electronics AG has licensed several engineering resin companies to develop material formulations to produce 3D-MID circuits using the LDS process and anticipates that additional resins formulated for LDS will also become available.

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