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Article

Laser Scribed MIDs Taking Off

SpecialChem / Jul 15, 2008

As mobile and other electronic devices become increasingly sophisticated and more compact, the traditional two-dimensional circuit board is being replaced by circuitry directly patterned on the three-dimensional device contours. While it is possible to mold actual circuit boards, this approach severely limits design flexibility. An alternative, developed by industrial laser equipment manufacturer LPKF Laser & Electronics AG, which integrates electronic components with functional mechanical parts is an important mechatronic milestone that brings fresh impetus to MID (molded interconnect device) technology.

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