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Multifaceted Electronic Semiconductor Encapsulation Emerging Fast

SpecialChem / Mar 17, 2008

The trillion-plus-dollar per annum semiconductor packaging (encapsulation) market, currently dominated by thermoset epoxy could become significant for injection molders. Every semiconductor needs encapsulation, which both protects the semiconductor and serves as the bridge between the electrical device and a product's printed circuit board (PCB). Epoxies with their low viscosity at relatively low temperatures have a major advantage as the epoxy simply flows over the electronics to be embedded without damaging the microchips during epoxy transfer molding, presently the typical process used for encapsulating semiconductors. In contrast, thermoplastic engineering plastics are typically too viscous even at moderate temperatures. As these viscous materials are forced under pressure over the electronic features, the resulting mechanical stress can damage delicate electronics. Secondly, epoxy encapsulation is a proven and entrenched technology for this huge industry. Epoxy materials however have serious and growing disadvantages.

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