OK
The Universal Selection Source:
Plastics & Elastomers
Article

Novel Ceramic Additive Packages Enable Lower Cost Thermally Conductive Plastics

SpecialChem / Donald McNally – Mar 18, 2013

Heat is the enemy. Since the time of Thomas Edison, electricity has played an ever-increasing role in our daily lives to the point where our civilization comes to a grinding halt when the power goes off. Nowhere is this more apparent than in the myriad of electronic devices with which we surround ourselves — smart phones, tablets, laptops, LED TVs, MP3 players, GPS units, and gadgets of all kinds.

All of these things run on electronic chips of one sort or another as do our refrigerators, our programmable thermostats, our automobiles — even our alarm clocks. Every time any electrical or electronic device does any work, a little bit of heat is lost to the environment. Most of the time, nobody notices this — unless of course they happen to be running high powered computing equipment or a server farm.

There is a constant struggle to embed more computing power into just about every appliance or device, whether it is a graphics card or a dishwasher. Integrated circuit chip manufacturers cram more and more circuitry into smaller and smaller spaces, with the 2012 record of 6.8 billion transistors on a specialized field-programmable gate array made by the company Xilinx.

A commercially available CPU chip from Intel, the 10-core Xeon Westmere-EX, has more than 2.5 billion transistors all crammed into a flat package a little more than two inches on a side. Given that the chip can run at clock speeds over 2 GHz and perform multiple operations per clock cycle, there's a whole lot of transistor switching that goes on — billions of times per second...

Be the first to comment on "Novel Ceramic Additive Packages Enable Lower Cost Thermally Conductive Plastics"

Leave a comment





Your email address and name will not be published submitting a comment or rating implies your acceptance to SpecialChem Terms & Conditions
Dow Far
Back to Top