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Plastics & Elastomers

Solderable Electronic Film Opens FPC Niche

SpecialChem / Oct 22, 2007

The German Research Foundation (DFG) sponsored research work at the University of Erlangen to develop high temperature resistant films as a new base material for flexible printed circuit (FPC) boards. The Erlangen investigations focused on the high temperature thermoplastic (TP) polyetheretherketone (PEEK).

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