EP110F8-5 by Master Bond is a moderate viscosity two-component high performance epoxy (EP) system for potting, sealing, encapsulating and casting applications. It provides good flow, low shrinkage... view more

EP114 by Master Bond is a low viscosity, two-component nanosilica filled epoxy (EP) system for potting, encapsulating, coating and sealing applications. It provides very long open time... view more

EP13LTE by Master Bond is an electrically insulating, thermally conductive, one component, heat curing epoxy for structural bonding and sealing applications. It offers high temperature resistance... view more

EP13SPND-2 by Master Bond is a heat-curing, one-component epoxy (EP) system. Offers good electrical insulation and high adhesion. Exhibits good dimensional stability, high tensile shear, compressive... view more

EP17HTDA-2 by Master Bond is a thermally conductive, electrically insulative, one component heat cured epoxy (EP) system with high compressive strength. It is suitable for sealing and die attach... view more

EP17HTND-CCM is an electrically insulating, heat cured, one-component epoxy (EP) system by Master Bond. Resists many chemicals, such as acids, bases, fuels, salt and oils. Offers low shrinkage... view more

EP17HTS-DA by Master Bond is a silver-filled, one-component epoxy (EP) system. Offers high bond strength and withstands mechanical & thermal shocks. Exhibits high temperature- & low volume... view more

EP21AC by Master Bond is a halogen-free, two component epoxy (EP) system. It is durable, flame-retardant and easy-to-use grade. Offers good dimensional stability, toughness, strength and low... view more

EP21ARHT by Master Bond is a 100% reactive, two-component high performance epoxy (EP) resin system for high performance bonding, sealing, coating and encapsulating applications. It does not contain... view more

EP21BAS by Master Bond is a two component, radiopaque epoxy system with more than 50% by weight of high purity ceramic, non-toxic filler. It is suitable for bonding, sealing, coating and... view more

EP21FRNS-2 is a flame-retardant, halogen-free, two component epoxy (EP) system by Master Bond. Offers low smoke, good resistance to thermal cycling & shock and excellent electrical insulation... view more

EP21LVMed by Master Bond is a biocompatible, low viscosity, two component epoxy (EP) resin system for high performance bonding, sealing, coating, encapsulating and casting applications. It provides... view more

EP21NS by Master Bond is an electrically insulating, nanosilica filled epoxy (EP) system with moderate viscosity and good flow properties. It is 100% reactive and does not contain any solvents or... view more

EP21TCHT-1 is a two-component epoxy (EP) system by Master Bond. Offers low coefficient of thermal expansion, good thermal conductivity and electrical insulation. Exhibits high strength and resists... view more

EP21TDCHT by Master Bond is a versatile, high performance, two component epoxy (EP) for bonding, sealing and coating. It exhibits moderate viscosity, good dimensional stability, easy application... view more

EP21TDCS-LO is a silver filled, durable, two-component epoxy (EP) system by Master Bond. It is a 100% reactive and does not contain solvent and volatiles. It bonds well with variety of substrates... view more

EP21TP-2NV by Master Bond is a versatile two component epoxy (EP) polysulfide system formulated to cure at room temperature with easy mixing forgiving 1:1 mix ratio. It is suitable for bonding... view more

EP21TPHT by Master Bond is a two component epoxy polysulfide system for bonding, sealing, coating and encapsulating applications. It offers good hardness, elongation, flexibilty, superior electrical... view more

EP29LPSP is a high performance, two-component epoxy (EP) system by Master Bond. It has low viscosity and does not contain solvent and volatiles. It bonds well with variety of substrates including... view more

EP29LPTCHT by Master Bond is a thermally conductive, electrically insulating, two component epoxy system. It is suitable for large potting, specialty bonding and encapsulation applications. It offers... view more