TECACOMP® LCP LDS black 4107

TECACOMP® LCP LDS black 4107 is a liquid crystal polymer (LCP) by Ensinger. It is developed for the LPKF-LDS® process. Suitable for all popularly used soldering techniques up to 260°C and optimized filler systems for fine pitch structures up to 70µm. Offers reduced thermal expansion in the event of temperature changes and enhanced thermal conductivity for improved cooling. LDS requires the compound to have high thermal resistance, isotropic component behavior and good capacity for metallization. Designed for automotive industry, electrical engineering, LED lighting technology and mechanical engineering. Suggested for processing by injection molding. TECACOMP® LCP LDS black 4107 is used in compounds for laser direct structuring, smart phone antennae, hearing aid and 3D HIPMAS.