by SpecialChem

TECACOMP® PEEK LDS black 1047045

Technical Datasheet | Supplied by Ensinger

TECACOMP® PEEK LDS black 1047045 by Ensinger is a mineral filled polyether ether ketone (PEEK) compound developed for the LPKF-LDS® process. Offers reduced thermal expansion in the event of temperature changes and enhanced thermal conductivity for improved cooling. Suitable for all popularly used soldering techniques up to 260°C and optimized filler systems for fine pitch structures up to 70µm. Suggested for processing by injection molding. Designed for electrical & mechanical engineering and medical technology. LDS requires the compound to have high thermal resistance, isotropic component behavior and good capacity for metallization. TECACOMP® PEEK LDS black 1047045 is used in compounds for laser direct structuring, smart phone antennae, hearing aid and 3D HIPMAS.

TECACOMP® PEEK LDS black 1047045 Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Density

1.67 g/cm³

Water Absorption at Saturation

< 0.1 %

(At 23°C, 50% R.H.)

DIN EN ISO 62

Linear Mold Shrinkage, Flow

0.52 %

DIN EN ISO 294-4

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Cylinder Temperature

360 - 400 °C

Mold Temperature

160 - 210 °C

Material Temperature

390 - 400 °C

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TECACOMP® PEEK LDS black 1047045

TECACOMP® PEEK LDS black 1047045 Properties

Physical Properties

TECACOMP® PEEK LDS black 1047045 Processing Guidelines

Injection Molding Properties