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CYCOM® 5250-4 RTM

Technical Datasheet | Supplied by Syensqo

CYCOM® 5250-4 RTM by Syensqo is a very low viscosity, one-part, low tack bismaleimide (BMI) resin. It possesses superior hot/wet properties at 71-190°C.

Exhibits good toughness and processability.
It shows low thermal conductivity, out-time >60 days at room temperature.
It offers highest open hole compression (OHC) value of any organic matrix resin.
Provides ease of handling and maximum capability to fabricate complex parts.
CYCOM® 5250-4 RTM is suitable for processing by resin transfer molding (RTM).
Designed for aerospace applications, wing stabilizer spars, fuselage skins & stiffeners, low operating temperature, critical load-bearing and engine components.

CYCOM® 5250-4 RTM Properties

Mechanical Properties

Value & Unit

Test Condition

Test Method

Compressive Strength

214 MPa

(After Impact, Toughness at Cure:191°C, 4 hr (IM7-6K-4HS, 1500in-lb/in), CAI laminate, F.V.=58%)

SACMA SRM 2

Compressive Strength

179 MPa

(After Impact, Toughness at Cure:177°C, 6 hr (IM7-6K-4HS, 1500in-lb/in), CAI laminate, F.V.=58%)

SACMA SRM 2

Notch Sensitivity

0.85 MPa/m^1/2

(K1c, Cure at 6 hr, 177-191°C + Post Cure at 4 hr, 227°C)

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