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EPICLON® 860

Technical Datasheet | Supplied by DIC Corporation
EPICLON® 860 by DIC Corporation is a bondable, bisphenol A based epoxy resin. It can be used in broad applications including civil engineering, adhesives, electrical insulating materials and reactive intermediates. EPICLON® 860 is recommended for resist ink and coating applications.
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Product Type
EP (Epoxy, Epoxide resin)
Physical Form
Semi-solid
Product Status
COMMERCIAL

EPICLON® 860 Properties

Physical Properties

Value & Unit
Test Condition
Test Method
Viscosity
P - U -
(25°C, Gardner, 70% solid in butyl carbitol) 
Epoxide Equivalent Weight
235 - 255 g/eq
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