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20-3035

Technical Datasheet | Supplied by Epoxies Etc
20-3035 by Epoxies Etc is a low density, two component epoxy resin. It exhibits low shrinkage during the cure cycle, low coefficient of thermal expansion, low dielectric constant and excellent moisture resistance. It provides high strength & stiffness, good thermal & environmental stability, creep resistance and water resistance. It can be cured at 25°C for 16-24 hours. 20-3035 is designed for potting and encapsulating electronic compounds.
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Product Type
EP (Epoxy, Epoxide resin)
Product Status
COMMERCIAL
Applications/ Recommended for
  • Electronics / Computers
  • Conversion of composites & thermosets > Potting
  • Conversion of composites & thermosets > Encapsulating

20-3035 Properties

Mechanical Properties

Value & Unit
Test Condition
Test Method
Hardness, Shore D
80
(Catalyst 190) 
Flexural Strength
7000 psi
(Catalyst 190) 
Compressive Strength
12000 psi
(Catalyst 190) 
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