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EP29LPTCHT

Technical Datasheet | Supplied by Master Bond
EP29LPTCHT by Master Bond is a thermally conductive, electrically insulating, two component epoxy system. It is suitable for large potting, specialty bonding and encapsulation applications. It offers exceptionally low thermal resistance, superior dimensional stability, low viscosity with excellent flow properties.
  • It exhibits low exotherm and very low shrinkage upon curing.
  • It bonds well with metals, glass, ceramics and many different plastics.
  • It provides resistance to water, fuels & oils and has a long working life at ambient temperatures.
  • Applicable in very thin bond lines and is ideal for underfill applications.
  • It has a shelf life of 6 months at 75°F in original, unopened containers.
  • EP29LPTCHT complies with RoHS and meets NASA low outgassing.
ORIGINAL DATASHEET CONTACT SUPPLIER
EP29LPTCHT
Technical Datasheet | Supplied by Master Bond
ORIGINAL DATASHEET CONTACT SUPPLIER
Product Type
EP (Epoxy, Epoxide resin)
Physical Form
Paste
Product Status
COMMERCIAL

EP29LPTCHT Properties

Thermal Properties

Value & Unit
Test Condition
Test Method
Thermal Conductivity
9 - 10 BTU-in/hr-ft²-°F
(At 75°F) 
Service Temperature
-51 - 177 °C
CTE, Linear
22x10-6 - 24x10-6 in/in-°C
(At 75°F) 
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