The new engineering materials powerhouse

by SpecialChem

EPON™ Resin CS-373

Technical Datasheet | Supplied by Westlake Epoxy

EPON™ Resin CS-373 by Westlake Epoxy is a one-pack, dicy-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of methyl ethyl ketone (MEK) and propylene glycol monomethyl ether (PGME). It exhibits high glass transition temperature, excellent thermal stability, flame retardance, fluorescence for automated optical inspection (AOI) and increased optical density for UV blocking. This grade offers resistance to temperatures of lead-free soldering operations, moisture and conductive anodic filament (CAF). It possesses fast treater speeds and reduced laminate cure times. EPON™ Resin CS-373 is used in FR-4 printed circuit board applications and laminates with a nominal glass transition temperature of 180°C.

EPON™ Resin CS-373 Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Bromine Content

12.5 - 14.5 %

(By Weight)

Chlorine Content

< 0.035 %

(Hydrolyzable, By Weight)

ASTM D1726

Color, Gardner

< 3

ASTM D1544

Want to list or
update your products?

View the listing options

Want to report errors or
suggest improvements?

Send a Feedback

Products with the same brand name

View more (77)