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Photo-Resin X004M

Technical DataSheet | Supplied by BASF

Photo-Resin X004M by BASF is a UV-reactive, low-melting polyamide 6 (PA 6) grade. It has been specially optimized for stereolithography (SLA), digital light processing (DLP) and LCD printers. Exhibits high tensile strength and high elasticity modulus. Photo-Resin X004M is used in the area of ceramic photopolymers, which allow additive manufacturing of metal-casting molds for applications in aerospace and automotive sectors.

Photo-Resin X004M Product details

Product Type
CAS Number
Product Launch Date
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Applications/ Recommended for
  • Aerospace/ Aircrafts
  • Automotive
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Key Features
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Last edited Apr 11, 2018
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