by SpecialChem

Photo-Resin X004M

Photo-Resin X004M by BASF is a UV-reactive, low-melting polyamide 6 (PA 6) grade. It has been specially optimized for stereolithography (SLA), digital light processing (DLP) and LCD printers. Exhibits high tensile strength and high elasticity modulus. Photo-Resin X004M is used in the area of ceramic photopolymers, which allow additive manufacturing of metal-casting molds for applications in aerospace and automotive sectors.

Read More View less

Product Type

PA (Polyamide, Nylon) > PA 6 (Nylon 6)

CAS Number

25038-54-4

Product Launch Date

Apr 9, 2018

Access full datasheet

Help us improve the Universal Selector

You can’t find what you are looking for? Please report missing products / suppliers, point out errors, or simply tell us how we could make the Universal Selector better.

Send a Feedback