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Zytel® HTN53G50LWSF BK702A

Technical Datasheet | Supplied by Celanese

Zytel® HTN53G50LWSF BK702A by Celanese is a 50% glass fiber reinforced, lubricated, high performance polyamide (PA) resin with low warpage. It exhibits high impact resistance, good stiffness and good heat stability. It contains additives as release agents. It is designed for processing by injection molding. Zytel® HTN53G50LWSF BK702A is suitable for automotive, electrical & electronics, domestic appliances and construction applications.

Zytel® HTN53G50LWSF BK702A Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Linear Mold Shrinkage

0.3 %

ISO 294-4, 2577

Linear Mold Shrinkage, Flow

0.1 %

ISO 294-4, 2577

Density

1580 kg/m³

ISO 1183

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Drying Temperature

> 100 °C

Melt Temperature

280 - 300 °C

Moisture Content

< 0.1 %

*The last time this product was checked, its availability could not be confirmed. If you have more information about its availability, please contact us.

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Zytel® HTN53G50LWSF BK702A

Zytel® HTN53G50LWSF BK702A Properties

Physical Properties

Zytel® HTN53G50LWSF BK702A Processing Guidelines

Injection Molding Properties