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Hepla® H1105SF EC EMI

Technical Datasheet | Supplied by Jiangsu NFD Composites

Hepla® H1105SF EC EMI by Jiangsu NFD Composites is an electrically conductive acrylonitrile butadiene styrene (ABS) resin filled with 5% stainless steel fiber. Shows electromagnetic shielding (EMI), radiofrequency shielding (RFI), ESD protection and good dimensional stability. It is suitable for processing by injection molding. Hepla® H1105SF EC EMI complies with RoHS.

Hepla® H1105SF EC EMI Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Density

1.09 g/cm³

ASTM D792

Linear Mold Shrinkage, Flow

0.5 - 0.7 %

(At 3.20 mm)

ASTM D955

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Melt Temperature

204 - 246 °C

Mold Temperature

66 - 82 °C

Drying Temperature

82 °C

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Hepla® H1105SF EC EMI

Hepla® H1105SF EC EMI Properties

Physical Properties

Hepla® H1105SF EC EMI Processing Guidelines

Injection Molding Properties