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LNP™ THERMOCOMP™ Compound DX11354

Technical Datasheet | Supplied by SABIC
LNP™ THERMOCOMP™ Compound DX11354 by SABIC is a compound based on PFAS-free, unfilled, colorable, impact resistant, polycarbonate (PC) resin that contains proprietary fillers. It offers improved plating surface, dielectrics and mechanical performance. LNP™ THERMOCOMP™ Compound DX11354 is suitable for laser direct structuring (LDS). It is recommended for automotive interiors and consumer applications like personal accessories. It is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.
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Product Type
PC (Polycarbonate) > PC
Appearance
Black
Product Status
COMMERCIAL

LNP™ THERMOCOMP™ Compound DX11354 Properties

Thermal Properties

Value & Unit
Test Condition
Test Method
UL RTI, Electrical
80 °C
UL 746B
UL RTI, Mechanical with Impact
80 °C
UL 746B
UL RTI, Mechanical without Impact
80 °C
UL 746B

LNP™ THERMOCOMP™ Compound DX11354 Processing Guidelines

Injection Properties

Value & Unit
Test Condition
Test Method
Vent Depth
0.038 - 0.076 mm
Drying Time
3 - 4 hr
Nozzle Temperature
275 - 300 °C
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