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LNP™ THERMOCOMP™ Compound DX15354

Technical Datasheet | Supplied by SABIC
LNP™ THERMOCOMP™ Compound DX15354 by SABIC is a compound based on PFAS-free, unreinforced polycarbonate resin. It offers dielectrics, improved plating surface, mechanical performance and high temperature resistance. It is suitable for laser direct structuring. It is processed by injection molding. LNP™ THERMOCOMP™ Compound DX15354 is used in automotive interiors and consumer applications like personal accessories. LNP™ THERMOCOMP™ Compound DX15354 is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.
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Product Type
PC (Polycarbonate) > PC
Appearance
Black
Product Status
COMMERCIAL

LNP™ THERMOCOMP™ Compound DX15354 Properties

Physical Properties

Value & Unit
Test Condition
Test Method
Density
1.29 g/cm3
ASTM D792
Melt Volume Flow Rate (MVR)
22.8 cm3/10 min
(At 300°C, 1.2 kgf) 
ISO 1133
Moisture Absorption
0.13 %
(At 23°C, 50% RH) 
ISO 62

LNP™ THERMOCOMP™ Compound DX15354 Processing Guidelines

Injection Properties

Value & Unit
Test Condition
Test Method
Vent Depth
0.025 - 0.08 mm
Front Zone 3 Temperature
300 - 345 °C
Back Pressure
0.3 - 0.7 MPa
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