by SpecialChem

LNP™ THERMOCOMP™ Compound EC006 (Asia)

LNP™ THERMOCOMP™ Compound EC006 (Asia) by SABIC is a compound based on PFAS-free, electrically conductive polyetherimide (PEI) grade reinforced with 30% carbon fiber. It is suitable for processing by injection molding. Shows high stiffness & strength and heat resistance. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound EC006 (Asia) is designed for use in automotive, aerospace and building components & constructions. It is suitable for consumer applications like sports/leisures, home- & commercial appliances. It is recommended for electrical industry and electronic applications such as mobile phones, computers & tablets.

LNP™ THERMOCOMP™ Compound EC006 (Asia) Properties

Physical Properties

Value & Unit

Test Condition

Test Method

Linear Mold Shrinkage, Flow

0.1 %

(At 24 hrs)

ISO 294

Linear Mold Shrinkage, Transverse

0.39 %

(At 24 hrs)

ISO 294

Moisture Absorption

0.28 %

(At 23°C, 50% RH)

ISO 62

Injection Properties

Value & Unit

Test Condition

Test Method

Vent Depth

0.025 - 0.076 mm

Back Pressure

0.3 - 0.7 MPa

Front Zone 3 Temperature

380 - 400 °C

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LNP™ THERMOCOMP™ Compound EC006 (Asia)

LNP™ THERMOCOMP™ Compound EC006 (Asia) Properties

Physical Properties

LNP™ THERMOCOMP™ Compound EC006 (Asia) Processing Guidelines

Injection Properties