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LNP™ THERMOCOMP™ Compound RF008ESY

LNP™ THERMOCOMP™ Compound RF008ESY (LNP™ THERMOCOMP™ Compound RF-1008 EM HS) is a crystalline, heat stabilized polyamide 66 (PA 66) resin reinforced with 40% glass fiber. Exhibits easy molding, high impact strength, excellent thermal performance, high heat resistance, high stiffness and good economics. Provides good processability, good paintability and can be modified with tougheners and internal lubricants. Processed by injection molding.

LNP™ THERMOCOMP™ Compound RF008ESY Properties

Mechanical Properties

Value & Unit

Test Condition

Test Method

Tensile Strength

168 MPa

(at Break, 23°C, 50% RH)

ISO 527-2

Flexural Strength

263 MPa

(23°C, 50% RH)

ISO 178

Tensile Strain

2.8 %

(at Break, 23°C, 50% RH)

ISO 527-2

Injection Molding Properties

Value & Unit

Test Condition

Test Method

Drying Temperature

80 °C

Mold shrinkage - Flow, 24 hrs

0.17 %

Drying Time

4 hr

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LNP™ THERMOCOMP™ Compound RF008ESY

LNP™ THERMOCOMP™ Compound RF008ESY Properties

Mechanical Properties

LNP™ THERMOCOMP™ Compound RF008ESY Processing Guidelines

Injection Molding Properties