KetaSpire® KT-825

KetaSpire® KT-825 by Syensqo is a uniform PEEK grade. Exhibits 50% greater stiffness than neat PEEK without conventional reinforcements. It is processed by injection molding and extrusion. It bridges the performance gap between unfilled PEEK and traditional glass fiber or carbon fiber reinforced PEEK grades. Possesses good elongation, low specific gravity, easy processability, good ductility, toughness and high dielectric strength compared to neat PEEK grades. Provides increased stiffness of reinforced grades and low anisotropy in resin properties along the flow and cross flow directions. Provides an advantage over other commercial neat PEEK grades, which do not meet the UL 94 V-0 flammability rating requirements at 0.8 cm thickness. KetaSpire® KT-825 possesses 50% greater modulus than that of the natural resin below the glass transition temperature (Tg) of PEEK (150°C). At temperatures above the Tg, the tensile and flexural modulus are two times that of unfilled PEEK. It is a more robust material than unfilled PEEK for use in applications that approach or slightly exceed operating temperatures of 150°C. Also possesses 10% higher flexural strength, 10°C higher heat deflection temperature (HDT) at 1.84 MPa (264 psi) than standard unfilled PEEK and 70% higher dielectric strength relative to neat PEEK. Is suitable for applications where a combination of high mechanical properties and a high degree of electrical insulation is needed. KetaSpire® KT-825 is recommended for automotive and aerospace and in structural applications in mobile electronics where a good balance of stiffness and toughness are required along with a low specific gravity.