Novamid® ID 1070 by Envalior is a very ductile and strong, high-performance, high-value polyamide copolymer grade present as filaments. It can withstand harsh environments and high temperatures of up to... view more

LNP™ THERMOCOMP™ AM DC004XXA11 by SABIC is a compound based on high heat PC copolymer resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications... view more

HiFill® PP FR 2020 is a flame retardant, polypropylene copolymer (PP) grade. Exhibits increased strength and stiffness. Can be processed using injection molding. Suitable for the growing 3D-printing... view more

HiFill® MD POM 0167 LE is a polyoxymethylene (POM) copolymer grade reinforced with metallic filler. Is metal detectable and exhibits low extractables. Can be processed using injection molding. It is... view more

HiFill® POM 0169 B LE is a polyoxymethylene (POM) copolymer grade. Is metal detectable and exhibits low extractables. Can be processed using injection molding. Suitable for the growing 3D-printing... view more

HiFill® POM 0169 S2 LE is a polyoxymethylene (POM) copolymer grade. Is metal detectable and exhibits low extractables. Can be processed using injection molding. Suitable for the growing 3D-printing... view more

HiFill® POM 0212 B is a polyoxymethylene (POM) copolymer grade. Exhibits high specific gravity. Can be processed using injection molding. Suitable for the growing 3D-printing market and large-part... view more