LNP™ THERMOCOMP™ Compound D551 by SABIC is a non-brominated, non-chlorinated, flame retarded, impact resistant polycarbonate (PC) resin reinforced with 50% glass fiber. It offers high modulus, high stiffness &... view more

LNP™ THERMOCOMP™ Compound DC006ER by SABIC is a compound based on PFAS-free, electrically conductive, polycarbonate (PC) resin that is filled with 30% carbon fiber. It offers easy molding, enhanced mold release, good... view more

LNP™ THERMOCOMP™ Compound DF002ER (Americas) by SABIC is a compound based on PFAS-free, electrically conductive, polycarbonate (PC) resin that is filled with 10% glass fiber. It offers easy molding, enhanced mold release, good... view more

LNP™ THERMOCOMP™ Compound DF002ER (Europe) by SABIC is a compound based on PFAS-free, electrically conductive, polycarbonate (PC) resin that is filled with 10% glass fiber. It offers easy molding, enhanced mold release, good... view more

LNP™ THERMOCOMP™ Compound DF004ER by SABIC is a compound based on PFAS-free, polycarbonate (PC) resin that is filled with 20% glass fiber. It offers easy molding, enhanced mold release, good processability and high... view more

LNP™ THERMOCOMP™ Compound DF006ER by SABIC is a compound based on PFAS-free, polycarbonate (PC) resin that is filled with 10% glass fiber. It offers easy molding, enhanced mold release, good processability and high... view more

LNP™ THERMOCOMP™ Compound EX11414 by SABIC is an electrically conductive, light weight polyetherimide (PEI) resin reinforced with 20% carbon fiber. It exhibits good mold release, high heat... view more

LNP™ THERMOCOMP™ Compound HF006EU by SABIC is a heat- & UV-stabilized polyamide 11 (nylon 11) resin reinforced with 30% glass fiber. It offers mold release, high modulus, easy molding and high... view more

LNP™ THERMOCOMP™ Compound MFB71L by SABIC is a 35% glass bead and 5% glass fiber reinforced polypropylene grade. It shows low extractables, good dimensional stability, low warpage & good mold... view more

LNP™ THERMOCOMP™ Compound MX00709 by SABIC is a heat stabilized, 30% glass fiber reinforced polypropylene grade. It shows mold release, high modulus and high stiffness. It is processed by injection... view more

LNP™ THERMOCOMP™ Compound MX06403 by SABIC is heat & light stabilized, UV-stabilized and 20% glass fiber reinforced polypropylene grade. It shows good mold release, high modulus, high stiffness &... view more

LNP™ THERMOCOMP™ Compound MX99432 by SABIC is a 25% glass bead and 15% glass fiber reinforced polypropylene grade. It shows mold release, low warpage and high stiffness. It is processed by injection... view more

LNP™ THERMOCOMP™ Compound RF0039S (LNP™ THERMOCOMP™ Compound RF-1003 FR HS) is a heat-stabilized, flame-retarded polyamide 66 (PA 66) by SABIC. It is a structural grade and contains 15% glass fiber... view more

LNP™ THERMOCOMP™ Compound RF003ES by SABIC is a heat-stabilized, structural polyamide 66 (PA 66) grade. It contains 15% glass fiber and provides good mold release. Offers high modulus, high... view more

LNP™ THERMOCOMP™ Compound RF0049S by SABIC is a flame-retarded, heat-stabilized, structural polyamide 66 (PA 66) grade. Offers high stiffness and good mold release. It contains 20% glass fiber and... view more

LNP™ THERMOCOMP™ Compound RFB53XXZ (Americas) by SABIC is a compound based on PFAS-free, nylon 6/6 resin. It is reinforced with 15% glass fiber & 25% glass bead. It shows high strength & stiffness and low warpage. It is processed... view more

LNP™ THERMOCOMP™ Compound DX06094 by SABIC is a flame retardant, high impact resistant polycarbonate (PC) resin reinforced with 30% glass fiber. It is free from bromine and chlorine. Shows good mold... view more

LNP™ THERMOCOMP™ Compound DX06409 by SABIC is a compound based on PFAS-free, low extractable, 10% glass fiber filled, polycarbonate resin. It shows good processability, easy molding, mold release, enhanced mold... view more

LNP™ THERMOCOMP™ Compound DX06411 by SABIC is a compound based on PFAS-free, polycarbonate resin which is filled with 20% glass fiber. It shows good processability, enhanced mold release, easy molding and high... view more