LNP™ THERMOCOMP™ Compound 9F005P by SABIC is polycarbonate (PC) resin filled with 25% glass fiber. Provides high stiffness, good dimensional stability and exceptional processing. It shows CLTE close... view more

LNP™ THERMOCOMP™ Compound MX89510 by SABIC is a 10% glass bead and 10% glass fiber reinforced polypropylene grade. It shows good dimensional stability, mold release, low warpage and high stiffness... view more

LNP™ THERMOCOMP™ Compound PB006SXS by SABIC is a heat stabilized polyamide 6 (Nylon 6) grade containing 30% glass bead. It offers mold release, low warpage and good dimensional stability. It is... view more

LNP™ THERMOCOMP™ Compound PFB55 by SABIC is a 25% glass bead and 25% glass fiber reinforced polyamide 6 (Nylon 6) grade. It provides high stiffness, low warpage and good dimensional stability. It is... view more

LNP™ THERMOCOMP™ Compound PFW53U by SABIC is polyamide 6 (PA 6) grade containing mineral, 15% glass fiber and 25% wollastonite. It is a structural, weatherable, UV- and light stabilized grade... view more

LNP™ THERMOCOMP™ Compound PFW64 by SABIC is a low warpage, structural polyamide 6 (PA 6) grade. It contains mineral, 20% glass fiber and 30% wollastonite. Provides good mold release, high stiffness... view more

LNP™ THERMOCOMP™ Compound PX18002 by SABIC is a structural polyamide 6 (PA 6) grade. It contains 45% glass fiber and 10% glass bead and provides good dimensional stability. Exhibits good aesthetics... view more

LNP™ THERMOCOMP™ Compound RB00A by SABIC is a structural polyamide 66 (PA 66) grade. It is a heat stabilizer and contains 50% glass bead. Exhibits low warpage, good mold release and good dimensional... view more

LNP™ THERMOCOMP™ Compound DFZ22P by SABIC is a flame retardant polycarbonate grade reinforced with 10% glass fiber. It offers low warpage, good dimensional stability, mold release, high stiffness... view more

LNP™ THERMOCOMP™ Compound ZX08309 by SABIS is a polyphenylene ether and polystyrene (PPE+PS) blend reinforced with mineral (titanium dioxide). Provides heat stability, high dielectric constant and... view more