EPO-TEK® OE132-43 by Epoxy Technology is a single component, solvent containing polyimide grade. Designed high temperature applications found in semiconductor, hybrid, optical and medical devices... view more

Kerimid® 701 A A-70 by Huntsman is a non-MDA polyimide solution, supplied at 70% non-volatiles in acetone. Requires high service temperature and offers chemical- & moisture resistance, toughness and... view more

Kerimid® 701 A N-70 by Huntsman is a non-MDA polyimide solution, supplied at 70% non-volatiles in methyl etheyl ketone. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- &... view more

Kerimid® 701 C by Huntsman is a polyimide, used in conjunction with Kerimid® 701. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 701 C... view more

Kerimid® 701 D by Huntsman is a non-halogen containing polyimide component for Kerimid® 701 A. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties... view more

Kerimid® 701-1 B by Huntsman is polyimide grade. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 701-1 B is used in laminating products... view more

HPC-2200 by Resonac (formerly Showa Denko) is a NMP-free, polyamide-imide resin with low toxicity. It can form the film having high insulation and solvent resistance. This product possesses high heat resistance and... view more

HPC-3010A by Resonac (formerly Showa Denko) is a NMP-free, polyamide imide resin with low toxicity. It possesses high heat resistance and coating hardness. It can form the film having high insulation and solvent... view more

HPC-5012 by Resonac (formerly Showa Denko) is a polyamide-imide resin with low toxicity. This product possesses high heat resistance and coating hardness. HPC-5012 can form the film having high insulation and solvent... view more

HPC-6000 by Resonac (formerly Showa Denko) is a low temperature curable polyamide imide resin. It possesses high heat resistance and coating hardness. It can form the film having high insulation and solvent... view more

HPC-6600 by Resonac (formerly Showa Denko) is a NMP-free, polyamide-imide resin. It possesses low toxicity and coating hardness. HPC-6600 can form the film having high insulation and solvent resistance. Recommended... view more

KINEL® SK4525 S5A by Sumitomo Bakelite is a bismaleimide (BMI) resin reinforced with long glass fiber. It can be post cured at 225°C for 16 hours. It is a perfluorooctansulfonate (PFOS) free grade... view more

AVIMID® R by Syensqo is a high temperature thermoset polyimide resin with good wet and dry service capability. Available in a range of fibers and forms including tape, fabric, chopped fiber or... view more