EPICLON® 1050 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance and two-stage process. It can be used in broad applications including coatings, civil... view more

EPICLON® 1050-70X by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with xylene solvent. Exhibits good chemical resistance and good bondability. Offers excellent workability... view more

EPICLON® 1050-75X by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with xylene solvent. Exhibits good chemical resistance and good bondability. Offers excellent workability... view more

EPICLON® 1051-75M by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with methyl ethyl ketone (MEK) solvent. Exhibits good chemical resistance and good bondability. Offers excellent... view more

EPICLON® 1055 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance and one stage process. It can be used in broad applications including coatings, civil... view more

EPICLON® 1055-75X by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with xylene solvent. Exhibits good chemical resistance and good bondability. Offers excellent workability. EPICLON® 1055-75X is... view more

EPICLON® 1121N-80M by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It contains 80% solid in methyl ethyl ketone (MEK). EPICLON® 1121N-80M can be used in... view more

EPICLON® 1123P-75M by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It contains 75% solid in methyl ethyl ketone (MEK). EPICLON® 1123P-75M can be used in semiconductor/ electrical... view more

EPICLON® 152 by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It can be used in semiconductor/ electrical laminates in electric and electronic applications... view more

EPICLON® 153 by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It can be used in semiconductor/ electrical laminates in electric and electronic applications... view more

EPICLON® 153-60M by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It contains 60% solid in methyl ethyl ketone (MEK). EPICLON® 153-60M can be used in... view more

EPICLON® 153-60T by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It contains 60% solid in toluene. EPICLON® 153-60T can be used in semiconductor/electrical laminates in electric and... view more

EPICLON® 1650-75MPX by DIC Corporation is a dimer acid modified epoxy resin. Exhibits excellent thermal shock resistance, high flexibility and improved impact resistance. It contains 75% solid in xylene. EPICLON® 1650-75MPX... view more

EPICLON® 3050 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance. It can be used in broad applications including civil engineering, adhesives... view more

EPICLON® 4050 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance. It can be used in broad applications including civil engineering, adhesives... view more

EPICLON® 520 by DIC Corporation is a low viscosity, epoxy resin. It is diluted with reactive alkyl phenol mono glycidyl ether. It is 100% reactive system. EPICLON® 520 is recommended for... view more

EPICLON® 5300-70 by DIC Corporation is a fast curing type epoxy resin. Offers low temperature fast curability. It can be diluted in xylene and isobutanol solvents. EPICLON® 5300-70 is suitable for... view more

EPICLON® 5500 by DIC Corporation is a polyfunctional epoxy resin. It is designed to provide rapid cure. EPICLON® 5500 is suitable for powder coating for insulation applications... view more

EPICLON® 5800 by DIC Corporation is a polyfunctional epoxy resin. It is designed to provide rapid cure. EPICLON® 5800 is suitable for powder coating for insulation applications... view more

EPICLON® 7050 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance. It can be used in broad applications including civil engineering, adhesives... view more