Master Bond EP65HT-1 exhibits excellent adhesion to glass as well ceramics, metals and some plastics. It is a two-component epoxy system providing a high-volume resistivity of >1014 ohmcm suitable for use in electronic devices.
The unique nature of Master Bond EP65HT-1 allows for both rapid-cure and compliance with NASA’s stringent low-outgassing criteria. With set-up time of just 9-12 minutes at room temperature (10-20 gram mass) it provides excellent outgassing performance.