TAGS: Automotive High Heat Materials Cost Efficiency
Kuraray Co., Ltd. announces the development of a blister-resistant grade of GENESTAR™ heat-resistant polyamide resin. It significantly reduces rate of blister occurrence for automotive connectors.
Required Improvement for Thicker Connectors
With the shift to surface mounting technology (SMT) in automotive components, there is an expanded the use of
GENESTAR™ in automotive SMT connectors that work for reflow* processes, centering on the enhanced GN series of GENESTAR™.
The conventional grade of this product is also less prone to blistering, but automotive connectors are larger and thicker than connectors for consumer use, and increasingly severe SMT conditions become required further improvements in blister resistance.
In response to customer feedback, Kuraray conducted research and development over several years. It clarified the detailed mechanisms behind blistering, and developed a blister-resistant grade of product using over 20,000 evaluations and Kuraray's proprietary compounding technology.
*Reflow: A method of attaching components to printed circuit boards by printing solder paste (flux is added to solder powder to give it an appropriate viscosity), placing the components on top of the paste, and heating it to melt the solder.
Product Features
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The blister occurrence rate in SMT connectors has been significantly reduced* compared to the conventional grade.
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This has an excellent balance of strength and moldability required for automotive SMT connectors, and has obtained various UL certifications including flame retardant standard UL94 V-0.
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Because of its good color development, it works for automotive connectors that require high visibility. It can also match color products, including RAL colors, the German standard color chart.
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Another application is for industrial connectors used in harsh environments other than automobiles.
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Its excellent blister resistance improves the productivity of automotive electronic components and helps reduce costs.
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By improving reflow temperature and design freedom, this product helps realize safe, secure, and highly functional mobility.
*This data was tested under intense conditions where blistering may occur in the existing grade. The results are based on Kuraray’s proprietary testing system and do not guarantee the rate of blister occurrence for customers.
Source: Kuraray
