APPEEL™ 11D554 Peelable Resin by Dow is a modified ethylene vinyl acetate (EVA) copolymer resin. It acts as a sealing layer, offering easy open experience for lidding applications such as food containers... view more

EP114 by Master Bond is a low viscosity, two-component nanosilica filled epoxy (EP) system for potting, encapsulating, coating and sealing applications. It provides very long open time... view more

EP21BAS by Master Bond is a two component, radiopaque epoxy system with more than 50% by weight of high purity ceramic, non-toxic filler. It is suitable for bonding, sealing, coating and... view more

EP21LVMed by Master Bond is a biocompatible, low viscosity, two component epoxy (EP) resin system for high performance bonding, sealing, coating, encapsulating and casting applications. It provides... view more

EP21NS by Master Bond is an electrically insulating, nanosilica filled epoxy (EP) system with moderate viscosity and good flow properties. It is 100% reactive and does not contain any solvents or... view more

EP21TDCHT by Master Bond is a versatile, high performance, two component epoxy (EP) for bonding, sealing and coating. It exhibits moderate viscosity, good dimensional stability, easy application... view more